Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049837 | Bond wire array for packaged semiconductor device | Jitesh Vaswani, Ricardo Uscola | 2021-06-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049837 | Bond wire array for packaged semiconductor device | Jitesh Vaswani, Ricardo Uscola | 2021-06-29 |