Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10998255 | Overmolded microelectronic packages containing knurled flanges and methods for the production thereof | Jerry L. White, Hamdan Ismail, Frank E. Danaher, David J. Dougherty, Aruna Manoharan | 2021-05-04 |