Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133578 | Semiconductor device package comprising an encapsulated and conductively shielded semiconductor device die that provides an antenna feed to a waveguide | Antonius Hendrikus Jozef Kamphuis, Antonius Johannes Matheus de Graauw, Michael B. Vincent | 2021-09-28 |