Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11120191 | Multi-tier co-placement for integrated circuitry | Brian Tracy Cline, Stephen Lewis Moore, Saurabh Sinha | 2021-09-14 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11120191 | Multi-tier co-placement for integrated circuitry | Brian Tracy Cline, Stephen Lewis Moore, Saurabh Sinha | 2021-09-14 |