Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081469 | Three-dimensional integrated circuit test and improved thermal dissipation | Saurabh Sinha, Supreet Jeloka | 2021-08-03 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081469 | Three-dimensional integrated circuit test and improved thermal dissipation | Saurabh Sinha, Supreet Jeloka | 2021-08-03 |