Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133606 | Wire crimping structure and shielded conductive path | Kazuaki Hamada | 2021-09-28 |
| 11117300 | Mold clamping device | Hozumi Yoda, Satoshi Hoshino, Hiroo Okubo, Keiichi Tozawa | 2021-09-14 |
| 10910734 | Shielded cable with terminal | Kazuaki Hamada | 2021-02-02 |