Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043623 | Package including lead component having recess | — | 2021-06-22 |
| 10937666 | Method for manufacturing lead frame including electrode and hanger lead, method for manufacturing package having lead frame, and method for manufacturing light-emitting device having package | — | 2021-03-02 |
| 10886448 | Method for producing lead frame, method for producing package and method for producing light emitting device | — | 2021-01-05 |