Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075391 | Method for preparing modular planar interconnect plate, modular planar interconnect plate assembly including the interconnect plate, and stamping assembly for preparing the interconnect plate | Sea-Fue Wang, Fan Chen | 2021-07-27 |