Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056410 | Method of manufacturing semiconductor package using alignment mark on wafer | Sommawan Khumpuang, Fumito IMURA | 2021-07-06 |
| 11011403 | Transport container automatic clamping mechanism | Hitoshi Maekawa, Hiroyuki Nishihara, Koji Sagisawa | 2021-05-18 |