Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10886593 | Structure of integrated radio frequency multi-chip package and method of fabricating the same | Ching-Wen Chiang, Yen-Cheng Kuan | 2021-01-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10886593 | Structure of integrated radio frequency multi-chip package and method of fabricating the same | Ching-Wen Chiang, Yen-Cheng Kuan | 2021-01-05 |