Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11078117 | Thermally-conductive, low strength backfill material | Tomi Pekka Bernhard Nissinen, Xianrui Chen | 2021-08-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11078117 | Thermally-conductive, low strength backfill material | Tomi Pekka Bernhard Nissinen, Xianrui Chen | 2021-08-03 |