Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11104832 | Liquid epoxy resin sealing material and semiconductor device | Yohei Hosono | 2021-08-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11104832 | Liquid epoxy resin sealing material and semiconductor device | Yohei Hosono | 2021-08-31 |