Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183465 | Radio-frequency module | — | 2021-11-23 |
| 11177189 | Module including heat dissipation structure | Yoshitaka Matsukawa | 2021-11-16 |
| 11171067 | Module having a sealing resin layer with radiating member filled depressions | — | 2021-11-09 |
| 11164695 | Inductor component | Shinichiro Banba, Mitsuyoshi Nishide, Norio Sakai, Haruhiko Mori | 2021-11-02 |
| 11152157 | Stacked electronic component and method for manufacturing stacked electronic component | Issei Yamamoto, Kunihiro Miyahara | 2021-10-19 |
| 11139101 | Coil component | Norio Sakai | 2021-10-05 |
| 11075029 | Coil module | Shinichiro Banba, Norio Sakai, Mitsuyoshi Nishide | 2021-07-27 |
| 11051398 | Ceramic electronic component | Yosuke Matsushita, Issei Yamamoto, Shigeru Endo | 2021-06-29 |
| 10999956 | Module | — | 2021-05-04 |
| 10912188 | High-frequency component | Norio Sakai, Tetsuya Kanagawa | 2021-02-02 |
| 10886059 | Coil component | Junji Kurobe, Norio Sakai | 2021-01-05 |