Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11170935 | Manufacturing method for electronic component including electrode formed by removal of insulating layer by laser light | Eiji ISO, Shinichiro Izumi, Hirotsugu Tomioka, Tsuyoshi Kawada | 2021-11-09 |
| 10998117 | Wire-wound coil component and method for producing wire-wound coil component | Kohei Kobayashi, Takuya Ishida, Shinya Hirai | 2021-05-04 |