Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11202371 | Multilayer substrate | Shingo Ito | 2021-12-14 |
| 11114238 | Multilayer substrate, structure of multilayer substrate mounted on circuit board, method for mounting multilayer substrate, and method for manufacturing multilayer substrate | — | 2021-09-07 |
| 11075092 | Multi-layer substrate | — | 2021-07-27 |
| 11056756 | Multilayer substrate connecting body and transmission line device | — | 2021-07-06 |
| 11043626 | Multilayer substrate | Shingo Ito, Isamu Morita, Naoki Gouchi | 2021-06-22 |
| 10993329 | Board joint structure | Daisuke TONARU, Hideyuki Taguchi, Genro KATO | 2021-04-27 |
| 10893618 | Method for manufacturing multilayer substrate | Naoki Gouchi, Shingo Ito | 2021-01-12 |