Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056808 | Resin multilayer substrate, transmission line, module, and method of manufacturing module | Jun Sasaki, Yoichi Saito, Takahiro Baba, Yoshitomo Tanaka | 2021-07-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056808 | Resin multilayer substrate, transmission line, module, and method of manufacturing module | Jun Sasaki, Yoichi Saito, Takahiro Baba, Yoshitomo Tanaka | 2021-07-06 |