Issued Patents 2021
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211279 | Method for processing a 3D integrated circuit and structure | Zvi Or-Bach, Brian Cronquist | 2021-12-28 |
| 11177140 | 3D semiconductor device and structure | Zvi Or-Bach, Brian Cronquist | 2021-11-16 |
| 11163112 | Multilevel semiconductor device and structure with electromagnetic modulators | Zvi Or-Bach, Brian Cronquist | 2021-11-02 |
| 11164898 | Multilevel semiconductor device and structure | Zvi Or-Bach | 2021-11-02 |
| 11164811 | 3D semiconductor device with isolation layers and oxide-to-oxide bonding | Zvi Or-Bach, Brian Cronquist | 2021-11-02 |
| 11164770 | Method for producing a 3D semiconductor memory device and structure | Zvi Or-Bach, Brian Cronquist | 2021-11-02 |
| 11158674 | Method to produce a 3D semiconductor device and structure | Zvi Or-Bach, Brian Cronquist | 2021-10-26 |
| 11152062 | 1T-1R architecture for resistive random access memory | Wayne F. Ellis | 2021-10-19 |
| 11133351 | 3D semiconductor device and structure | Zvi Or-Bach | 2021-09-28 |
| 11133344 | Multilevel semiconductor device and structure with image sensors | Zvi Or-Bach, Brian Cronquist | 2021-09-28 |
| 11121021 | 3D semiconductor device and structure | Zvi Or-Bach, Brian Cronquist, Zeev Wurman | 2021-09-14 |
| 11107721 | 3D semiconductor device and structure with NAND logic | Zvi Or-Bach, Brian Cronquist | 2021-08-31 |
| 11101266 | 3D device and devices with bonding | Zvi Or-Bach, Brian Cronquist | 2021-08-24 |
| 11094576 | Methods for producing a 3D semiconductor memory device and structure | Zvi Or-Bach, Brian Cronquist | 2021-08-17 |
| 11087995 | 3D semiconductor device and structure | Zvi Or-Bach, Brian Cronquist | 2021-08-10 |
| 11088050 | 3D semiconductor device with isolation layers | Zvi Or-Bach, Brian Cronquist | 2021-08-10 |
| 11081176 | 2T-1R architecture for resistive RAM | Wayne F. Ellis, Brent Haukness, Gary B. Bronner, Thomas Vogelsang | 2021-08-03 |
| 11063071 | Multilevel semiconductor device and structure with waveguides | Zvi Or-Bach, Brian Cronquist | 2021-07-13 |
| 11043523 | Multilevel semiconductor device and structure with image sensors | Zvi Or-Bach, Brian Cronquist | 2021-06-22 |
| 11031275 | 3D semiconductor device and structure with memory | Zvi Or-Bach, Brian Cronquist | 2021-06-08 |
| 11024673 | 3D semiconductor device and structure | Zvi Or-Bach, Brian Cronquist | 2021-06-01 |
| 11018042 | 3D semiconductor memory device and structure | Zvi Or-Bach, Brian Cronquist | 2021-05-25 |
| 11018191 | 3D semiconductor device and structure | Zvi Or-Bach | 2021-05-25 |
| 11018133 | 3D integrated circuit | Zvi Or-Bach, Brian Cronquist | 2021-05-25 |
| 11004719 | Methods for producing a 3D semiconductor memory device and structure | Zvi Or-Bach, Brian Cronquist | 2021-05-11 |