Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195638 | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board | Katsuya Tomizawa, Meguru Ito, Eisuke Shiga | 2021-12-07 |
| 11186537 | Method for producing compound, compound, epoxy curing agent, and method for producing amine composition | Kazuyoshi Uera | 2021-11-30 |
| 10886838 | Semiconductor integrated circuit for discharging and power supply system | Chuhei TERADA | 2021-01-05 |