Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11166383 | Resin-clad copper foil, copper-clad laminated plate, and printed wiring board | Yoshihiro Yoneda, Toshifumi Matsushima, Toshihiro Hosoi | 2021-11-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11166383 | Resin-clad copper foil, copper-clad laminated plate, and printed wiring board | Yoshihiro Yoneda, Toshifumi Matsushima, Toshihiro Hosoi | 2021-11-02 |