Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158766 | Lid material for packages including reflowed gold-tin layers, and method for manufacturing package | Satoru Daido | 2021-10-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158766 | Lid material for packages including reflowed gold-tin layers, and method for manufacturing package | Satoru Daido | 2021-10-26 |