Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11161979 | Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board | Kentaro Nomizu, Mitsuru Ohta, Yoshinori Mabuchi | 2021-11-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11161979 | Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board | Kentaro Nomizu, Mitsuru Ohta, Yoshinori Mabuchi | 2021-11-02 |