Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11197379 | Method for producing printed wiring board | Takaaki Ogashiwa, Syunsuke Hirano, Yoshihiro Kato | 2021-12-07 |
| 11081367 | Support and method for producing semiconductor device-mounting substrate using the same | Shunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa | 2021-08-03 |
| 10964552 | Methods for producing laminate and substrate for mounting a semiconductor device | Yoshihiro Kato, Takaaki Ogashiwa, Yoichi Nakajima, Takaaki Ichikawa | 2021-03-30 |