Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177175 | Microelectronic devices and methods for filling vias in microelectronic devices | Kyle K. Kirby | 2021-11-16 |
| 11075146 | Microfeature workpieces having alloyed conductive structures, and associated methods | Warren M. Farnworth, Rick Lake | 2021-07-27 |