Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011420 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Hongqi Li, Anurag Jindal, Jin Lu | 2021-05-18 |
SR
Shyam Ramalingam
Overall (2021): #260,838 of 548,734Top 50%
1
Patents 2021