Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004475 | Methods and apparatuses for aligning read data in a stacked semiconductor device | — | 2021-05-11 |
| 10964702 | Semiconductor device with first-in-first-out circuit | Yuki Ebihara | 2021-03-30 |
| 10943622 | High bandwidth memory having plural channels | — | 2021-03-09 |
| 10943625 | Memory device with write data bus control | Chikara Kondo, Tomoyuki Shibata, Chiaki Dono, Minehiko Uehara, Taihei Shido +1 more | 2021-03-09 |
| 10922262 | Semiconductor layered device with data bus inversion | Yuki Ebihara | 2021-02-16 |
| 10916489 | Memory core chip having TSVS | Naohisa Nishioka | 2021-02-09 |
| 10885959 | Apparatuses and methods for semiconductor devices including clock signal lines | Ryosuke Yatsushiro | 2021-01-05 |