Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056467 | Semiconductor devices with through silicon vias and package-level configurability | James E. Davis, Warren L. Boyer | 2021-07-06 |
| 10930645 | Semiconductor devices with package-level configurability | James E. Davis, John B. Pusey, Zhiping Yin | 2021-02-23 |