Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127660 | Surface-mount integrated circuit package with coated surfaces for improved solder connection | Rangsun Kitnarong, Vichanart Nimibutr, Chanyuth Junjuewong | 2021-09-21 |
| 11101200 | Surface-mount integrated circuit package with coated surfaces for improved solder connection | Rangsun Kitnarong, Vichanart Nimibutr, Chanyuth Junjuewong | 2021-08-24 |