Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031345 | Integrated circuit package and method of forming same | Chunho Kim, Randolph E. Crutchfield | 2021-06-08 |
| 10950511 | Die carrier package and method of forming same | Mark E. Henschel | 2021-03-16 |