Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11005602 | HARQ buffer size design for communication systems | Wei-De Wu, Yen-Shuo Chang, Chia-Wei Tai, Hsien-Kai Hsin, Pei-Kai Liao | 2021-05-11 |
| 10958290 | Location of interleaver with LDPC code | Wei-Jen Chen, Ju-Ya Chen, Yen-Shuo Chang, Mao-Ching Chiu, Cheng-Yi Hsu +1 more | 2021-03-23 |