Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11026446 | High integrity encapsulation product | Shriram Paranjpe, Michael Reick, Chungsea Shen | 2021-06-08 |
| 10897918 | Extrusion encapsulation with narrow particle size and shape distribution, high solubility, and low surface oil | Shriram Paranjpe, Michael Reick, Chungsea Shen, Suzanne Johnson | 2021-01-26 |