Issued Patents 2021
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11204539 | Color error corrected segmented LED array | Arjen Gerben Van der Sijde, Brendan Jude Moran | 2021-12-21 |
| 11199755 | Illumination device with light guide having angled light-accepting surfaces | Varun Dev Kakkar, Arjen Gerben Van der Sijde, Erno Fancsali, Chunxia Feng | 2021-12-14 |
| 11184552 | Adaptive light source | Arjen Gerben Van der Sijde, Quint Van Voorst Vader, Yourii Martynov, Charles André Schrama | 2021-11-23 |
| 11145191 | Flash light emitter with remote communication function | Thierry De Smet, James Tarne, Arjen Gerben Van der Sijde, Olivier Meilhon | 2021-10-12 |
| 11137665 | Uniform, efficient, and color tunable ring flash for camera using LEDs with light emission from multiple sides | Varun Dev Kakkar, Arjen Gerben Van der Sijde, Erno Fancsali, Chunxia Feng | 2021-10-05 |
| 11086198 | Driver for an adaptive light source | Arjen Gerben Van der Sijde, Yourii Martynov | 2021-08-10 |
| 11076145 | Depth map generator | Arjen Gerben Van der Sijde | 2021-07-27 |
| 11073653 | Edge coupled light collimation for backlight | Mehdi Aas, Arjen Gerben Van der Sijde, Erno Fancsali | 2021-07-27 |
| 11076083 | Multi-color flash with image post-processing | Charles André Schrama, Arjen Gerben Van der Sijde | 2021-07-27 |
| 11029564 | Polarizing edge coupled light in backlight | Mehdi Aas, Arjen Gerben Van der Sijde, Erno Fancsali | 2021-06-08 |
| 10998298 | LED array module | Rob Jacques Paul Engelen, Frans Hubert Konijn, Charles André Schrama, Emanuel Nicolaas Hermanus Johannes Stassar, Erno Fancsali +1 more | 2021-05-04 |
| 10895800 | Segmented light or optical power emitting device with fully converting wavelength converting material and methods of operation | Arjen Gerben Van der Sijde, Quint Van Voorst Vader | 2021-01-19 |
| 10892387 | Lighting device with switching material | Arjen Gerben Van der Sijde, Marcel Rene Bohmer | 2021-01-12 |
| 10886152 | Method and system for dual stretching of wafers for isolated segmented chip scale packages | Arjen Gerben Van der Sijde, Brendan Jude Moran | 2021-01-05 |