Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11209326 | Pressure sensor device formed in board and electronic device including the same | Hyunwoo Sim, Yonghwa Kim, Dongil SON, Jaedeok LIM, Seungbum Choi | 2021-12-28 | |
| 11178731 | Induction heating device having improved working coil fixing structure | Seongho SON, Jaekyung Yang, Yongsoo Lee | 2021-11-16 | $28,000 |
| 11140753 | Induction heating device having improved component arrangement structure and assemblability | Seongho SON, Yongsoo Lee | 2021-10-05 | $21,000 |
| 10980156 | Induction heating device having improved cooling structure | Seongho SON, Yongsoo Lee | 2021-04-13 | $34,000 |