Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152296 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi +5 more | 2021-10-19 |
| 11046792 | Method of preparing (meth)acrylonitrile-based polymer for preparing carbon fiber | Jeong Hun Cho, Young Soo Song, Hyun Min Kim, Hyo Yong KIM, Joon-Hee Cho | 2021-06-29 |