Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943854 | Semiconductor package and semiconductor apparatus for use with high-frequency signals and improved heat dissipation | Shoujirou Kizu, Shinya TOMIDA | 2021-03-09 |
MN
Michikazu Nagata
Overall (2021): #330,114 of 548,734Top 65%
1
Patents 2021