Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11150198 | Method for inspecting ball grid array-type semiconductor chip package | Miran PARK, Hoyeon LEE | 2021-10-19 |
| 10902652 | Method and program for reducing artifacts by structural similarity, and medial imaging device | Jung Won Kwak, Sang Wook Lee, Byung Chul Cho, Chung Hwan Lee, Changhwan Kim | 2021-01-26 |