Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183423 | Liner structure in interlayer dielectric structure for semiconductor devices | — | 2021-11-23 |
| 10986036 | Method and apparatus for orchestrating resources in multi-access edge computing (MEC) network | Hung-Yu Wei, Kuo-Liang Chang Chien, Yao-Pang Chiang, Yu-Hsiang CHAO | 2021-04-20 |