Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11120182 | Methodology of incorporating wafer physical measurement with digital simulation for improving semiconductor device fabrication | Shauh-Teh Juang | 2021-09-14 |
JL
Jason Z. Lin
Overall (2021): #417,564 of 548,734Top 80%
1
Patents 2021