Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11044806 | Method for manufacturing multi-layer circuit board capable of being applied with electrical testing | Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Chin-Hsi Chang | 2021-06-22 |