Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10925170 | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Hideta Arai, Atsushi Miki, Ryo Fukuchi | 2021-02-16 |
| 10925171 | Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device | Hideta Arai, Atsushi Miki, Ryo Fukuchi | 2021-02-16 |