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Linping LI

JC Jwl (Zhejiang) Semiconductor Co.: 2 patents #1 of 3Top 35%
Overall (2021): #137,588 of 548,734Top 30%
2
Patents 2021

Issued Patents 2021

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11177141 Method for packaging a chip 2021-11-16
10985120 Chip packaging method and chip packaging structure Jinghao Sheng, Zhou Jiang 2021-04-20