Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11076502 | Apparatus, system, and method for cooling multi-chip modules via clustered fluid-cooled plates | Alexander I. Yatskov, Stephen Cleeton | 2021-07-27 |
| 10943874 | Apparatus, system, and method for mitigating warpage of integrated circuits during reflow processes | Peng Su, Jimmy Chun-Chuen Leung | 2021-03-09 |