Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916482 | Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more EWLB packages per wafer with encapsulant deposited under temperature and pressure | Yung Kuan Hsiao | 2021-02-09 |