Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11015089 | Polyimide film for semiconductor package reflow process, and manufacturing method therefor | Ho-Young Park, Tae-seok Lee | 2021-05-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11015089 | Polyimide film for semiconductor package reflow process, and manufacturing method therefor | Ho-Young Park, Tae-seok Lee | 2021-05-25 |