Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985059 | Preclean and dielectric deposition methodology for superconductor interconnect fabrication | Brian Wagner, Christopher F. Kirby, James T. Kelliher, Khyhouth Lim | 2021-04-20 |