JH

Jeffrey David Hartman

NG Northrop Grumman: 1 patents #55 of 296Top 20%
Overall (2021): #411,165 of 548,734Top 75%
1
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
10950778 Superconducting bump bond electrical characterization Aurelius L. Graninger, Joel D. Strand, Micah John Atman Stoutimore, Zachary Kyle Keane, JUSTIN C. HACKLEY 2021-03-16