Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201166 | Three dimensional semiconductor device including first and second channels and buried insulation and conductive patterns and method of manufacturing the same | Eun Yeoung Choi, Hyung Joon Kim, Su Hyeong Lee | 2021-12-14 |