Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164847 | Methods and apparatus for managing thermal behavior in multichip packages | Saravanan Sethuraman, Tonia G. Morris, Siaw Kang Lai, Yu Ying Ong | 2021-11-02 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164847 | Methods and apparatus for managing thermal behavior in multichip packages | Saravanan Sethuraman, Tonia G. Morris, Siaw Kang Lai, Yu Ying Ong | 2021-11-02 |