Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101158 | Wafer-scale membrane release laminates, devices and processes | Ari D. Brown, Joseph Oxborrow, Kevin L. Denis, Timothy Mark Miller | 2021-08-24 |
| 10923446 | Indium bump liftoff process on micro-machined silicon substrates | Ari D. Brown | 2021-02-16 |