Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121091 | Method for arranging two substrates | — | 2021-09-14 |
| 11101132 | Method and device for bonding of substrates | Andreas Fehkuhrer | 2021-08-24 |
| 11059280 | Device and method for bonding substrates | Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz | 2021-07-13 |
| 11020951 | Device and method for bonding substrates | Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz | 2021-06-01 |
| 11020950 | Device and method for bonding substrates | Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz | 2021-06-01 |
| 11020952 | Device and method for bonding substrates | Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz | 2021-06-01 |
| 11020953 | Device and method for bonding substrates | Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz | 2021-06-01 |
| 10991609 | Method and substrate holder for the controlled bonding of substrates | Dominik Zinner, Jurgen Markus Suss, Jurgen Mallinger, Thomas Plach | 2021-04-27 |
| 10954122 | Method for bonding of at least three substrates | Thomas Glinsner, Harald Zaglmayr | 2021-03-23 |
| 10943807 | Method and device for alignment of substrates | Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger | 2021-03-09 |
| 10886156 | Accomodating device for retaining wafers | Markus Wimplinger, Alexander Filbert | 2021-01-05 |