| 11206749 |
Tubular heat spreaders for memory modules and memory modules incorporating the same |
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| 11199967 |
Techniques for power management using loopback |
Matthew A. Prather |
2021-12-14 |
| 11195569 |
Memory devices configured to provide external regulated voltages |
Matthew A. Prather |
2021-12-07 |
| 11177007 |
Feedback for power management of a memory die using capacitive coupling |
Baekkyu Choi, Fuad Badrieh |
2021-11-16 |
| 11169587 |
Feedback for power management of a memory die using a dedicated pin |
Baekkyu Choi, Fuad Badrieh |
2021-11-09 |
| 11133052 |
Feedback for power management of a memory die using shorting |
Baekkyu Choi, Fuad Badrieh |
2021-09-28 |
| 11133053 |
Sensing and tuning for memory die power management |
Fuad Badrieh, Baekkyu Choi |
2021-09-28 |
| 11081161 |
Sensing and tuning for memory die power management |
Fuad Badrieh, Baekkyu Choi |
2021-08-03 |
| 11081565 |
Memory modules and memory packages including graphene layers for thermal management |
Chan H. Yoo, George E. Pax, Yogesh Sharma, Gregory A. King, Randon K. Richards |
2021-08-03 |
| 11069394 |
Refresh operation in multi-die memory |
Matthew A. Prather |
2021-07-20 |
| 11063018 |
Semiconductor device assemblies with electrically functional heat transfer structures |
— |
2021-07-13 |
| 11003386 |
Methods for on-die memory termination and memory devices and systems employing the same |
Eric J. Stave, Matthew A. Prather |
2021-05-11 |
| 10978426 |
Semiconductor packages with pass-through clock traces and associated systems and methods |
George E. Pax |
2021-04-13 |
| 10971422 |
Semiconductor die assembly having a heat spreader that extends through an underlying interposer and related technology |
— |
2021-04-06 |
| 10957417 |
On-die memory power analytics and management |
Fuad Badrieh, Baekkyu Choi |
2021-03-23 |
| 10950282 |
Methods for on-die memory termination and memory devices and systems employing the same |
Gary L. Howe, Eric J. Stave, Matthew A. Prather |
2021-03-16 |
| 10950580 |
Semiconductor device assemblies with lids including circuit elements |
— |
2021-03-16 |
